From the laboratory to the industrial end, micro-nano 3D printing reshapes the innovative path of semiconductor packaging.

2025-10-24

With the rapid development of information technology, fields such as artificial intelligence, big data, cloud computing and the Internet of Things are presenting unprecedented scale and complexity, thereby imposing higher requirements on computing systems in terms of performance, energy efficiency and intelligent processing capabilities. Against this backdrop, new computing architectures and chip design concepts for the future are emerging at an accelerated pace. The semiconductor industry is undergoing a paradigm shift from single-chip performance enhancement to multi-chip heterogeneous integration, and the importance of packaging technology has rapidly risen to become a core support for the continuous evolution of system performance.
To meet the multiple requirements of high-density integration, high-frequency and high-speed interconnection, heat dissipation and signal integrity, advanced packaging technologies urgently need to achieve smaller feature sizes, higher structural complexity and higher yield. However, traditional subtractive manufacturing processes (such as lit hography + etching) face challenges in processing flexibility and precision control. How to achieve rapid, customizable and low-cost structure construction at the micron or even sub-micron scale has become one of the key points for innovation and breakthrough in the packaging field. Micro-nano 3D printing, as an advanced manufacturing technology with extremely high structural freedom, ultimate precision control and wide material diversity, is demonstrating application potential in semiconductor packaging, testing and research and development.
I. Mofang Precision Micro-Nano 3D Printing: Reconstructing the Toolchain for Packaging, Testing, and R&D
Unlike traditional planar processing methods, micro-nano 3D printing achieves high-precision structure construction through layer-by-layer curing or material deposition, capable of flexibly constructing multi-dimensional, complex, and cross-scale geometric features. In advanced packaging and testing R&D scenarios, BMF's PμSL technology can achieve a minimum optical resolution of 2μm processing capability. During the manufacturing of test interposer samples and the prototype verification of Fan-Out substrates, it can build high-density micro-vias and complex wiring channels, effectively supporting the prototype development of new packaging architectures.
The traditional packaging prototype development cycle is long and the mold-making cost is high. Utilizing micro-nano 3D printing can directly read the design model without the need for mask plates, which is suitable for multiple rounds of iteration, verification, and fine-tuning of complex system packaging solutions. It is particularly important for the test and verification of the Chiplet heterogeneous integration structure.
In terms of material compatibility, the technology of Mofang supports the printing of various functional photopolymer resins, ceramic composites, hydrogels and conductive ink systems. It can be used to manufacture test pieces with functions such as conductivity and heat resistance, featuring extremely high scene adaptability and marginal manufacturing cost advantages, thereby reducing the overall R&D investment.
Typical application cases: From prototype development to system verification
In cooperation with domestic and foreign research institutions specializing in packaging and testing, the microArch S230A (precision: 2 μm) from Mofang Precision Technology has been successfully applied in multiple key stages. Recently, a South Korean research institution has successfully verified the feasibility of micro-nano 3D printing in the research and development and testing of semiconductor packaging.
In the research titled "3D Printed Fanout Interposer Substrates with Curved Through-Holes for Rapid Prototyping of Advanced Packaging" (DOI: 10.1109/ECTC51687.2025.00201), researchers developed a novel organic interposer substrate with embedded curved through-holes using the BMF micro-nano 3D printing technology.
This design aims to address the limitations of traditional redistribution layer (RDL) manufacturing, where each layer requires more than ten lithography steps, making it often too costly for small-batch or prototype production. This research has developed a novel RDL-based stacked structure that differs from traditional ones. Curved through-holes offer the potential to connect chips with different I/O interface pitches, enhancing design flexibility and achieving high interconnect density and signal integrity. The research team used the microArch? S230A (precision: 2 μm) 3D printing system to complete high-fidelity automated manufacturing. By integrating multiple manufacturing processes, the production process of the interposer has been significantly simplified, simultaneously enabling rapid prototyping of new layouts, low-cost large-scale expansion for professional applications, and a leap in RF performance based on low-loss dielectric and high-integrity metallization.

Fig. Three-dimensional CAD design drawing of the substrate.

In the paper titled "Quasi-Coaxial Through-Hole Integrated Additively Manufactured Antenna-in-Package (AiP) Lid Substrates" (DOI: 10.1109/ECTC51687.2025.00302), the research team introduced a 3D printed lid-type AiP substrate that integrates patch antennas, coplanar waveguides, and quasi-coaxial through-holes, providing an economical, efficient, and scalable solution for AiP substrates.
The team utilized the microArch? S230A (precision: 2 μm) 3D printing system to fabricate a polymer structure with dimensions of 5×7 mm, a thickness of 1.6 mm, and through-hole diameters of 200 μm. They successfully integrated a patch antenna, a coplanar waveguide, and a chip cavity into a highly integrated and high-performance AiP substrate. The substrate design achieved a resonant frequency of 27.94 GHz and was integrated with a ground metal layer, effectively suppressing electromagnetic interference to the chip.

Fig. Schematic diagram of the manufacturing process, front view of the patch antenna on the 3D printed substrate, optical microscope image of the CPW line on the 3D printed substrate, and cross-sectional schematic diagram.

III. Key Breakthroughs from Laboratory Verification to Mass Production Introduction
For a long time, micro-nano 3D printing has been mainly used for scientific research verification and concept prototype production, and has always struggled to cross the threshold of mass production. However, BMF Precision has been continuously delving into precision equipment, material systems, and process control, gradually promoting this technology's penetration into terminal manufacturing. It has successively launched industrial-grade ultra-high precision and composite precision light-curing 3D printing systems, covering 2μm, 10μm, and 25μm precision levels, respectively supporting high-end manufacturing demands of different sizes. The 25μm optical precision is suitable for manufacturing various substrate components in packaging structures, and the 2μm-level high-resolution printing has been applied in multiple industrial projects such as small micro-through-hole structure test pieces and miniature connector prototypes.
Encapsulation testing involves a large number of thermal, electrical and mechanical coupling environments, and the material properties need to have high dielectric stability, thermal conductivity, low moisture absorption, etc. The multiple photosensitive resin materials developed by Mofang have low loss and high-temperature stability, and show good spectral response and mechanical reliability in RF and microwave device testing. In response to the needs of industrial customers, Mofang has built a full-process standardized operation system covering design support → parameter optimization → printing execution → post-processing → quality control. At the same time, it is equipped with an intelligent operation interface and an automatic leveling system on the equipment side, which significantly reduces the operation threshold and error rate, and promotes the efficiency improvement of the R&D testing process.
It can be seen that as advanced packaging moves towards the new stage of nano-interconnection and heterogeneous integration, manufacturing precision will become the underlying capability for industrial development. Micro-nano 3D printing is also injecting new possibilities into packaging research and development. Domestic advanced manufacturing enterprises represented by BMF Precision are gradually bringing laboratory-level processes into industrial application and implementation, continuously providing collaborative manufacturing innovation capabilities for semiconductor packaging and testing research and development.

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From the laboratory to the industrial end, micro-nano 3D printing reshapes the innovative path of semiconductor packaging.